CVE-2020-11239

Use after free issue when importing a DMA buffer by using the CPU address of the buffer due to attachment is not cleaned up properly in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables

Affected

Qualcomm, Inc. · Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables

CVSS v3.1 NVD

7.8 HIGHCVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

CVSS v2.0 NVD

7.2 HIGHAV:L/AC:L/Au:N/C:C/I:C/A:C

EPSS

0.22% chance of exploitation in the next 30 days, 12th percentile

Published

2021-06-09

Updated

2024-08-04

Exploit collections (1)

• Android/Qualcomm/CVE-2020-11239github/securitylab

Security advisories

• https://www.qualcomm.com/company/product-security/bulletins/january-2021-bulletin

References

• CVE Record
• NVD entry